MgCu2
| MgCu2 | |
|---|---|
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| 別名 | Cu2Mg |
| 識別 | |
| CAS號 | 12054-17-0 
|
| PubChem | 71355210 |
| ChemSpider | 57534863 |
| SMILES |
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| 性質 | |
| 化學式 | Cu2Mg |
| 摩爾質量 | 151.4 g·mol−1 |
| 密度 | 5.76 g·cm−3[1] |
| 熔點 | 520 °C[2] |
| 若非註明，所有數據均出自標準狀態（25 ℃，100 kPa）下。 | |
MgCu2是由鎂和銅構成的二元金屬間化合物，屬立方晶系，其空間群為Fd3m，晶胞參數a = 7.04 Å。[3]MgCu2也是一類化合物的結構類型，具有這一結構的有LaNi2、CeFe2、CeOs2、EuIr2、EuPt2、TmRh2等。[4]
製備
MgCu2可由Mg2Cu的氫化反應，或銅和氫化鎂在高溫和壓強下反應得到：[5]
- 2 Mg2Cu + 3 H2 → 3 MgH2 + MgCu2
- MgH2 + 2 Cu → MgCu2 + H2↑
MgCu2也可以由化學計量比的單質在過量銅的存在下於380 °C反應製得。[6]
性質
- Cu2Mg + 2 B → 2 Cu + MgB2
- Cu2Mg + 6 B → 2 Cu + MgB6
- 14 Cu2Mg + 4 B2O3 → 28 Cu + MgB2 + MgB6 + 12 MgO
它也能和氫化鎂反應，生成正交晶系的Mg2Cu並放出氫氣。[8]
參考文獻
- ^ Cheng, C.H. The elastic constants of MgAg and MgCu2 single crystals. Journal of Physics and Chemistry of Solids. 1967, 28 (3): 413–416. ISSN 0022-3697. doi:10.1016/0022-3697(67)90307-1.
- ^ Chen, W.; Sun, J. The electronic structure and mechanical properties of MgCu2 Laves phase compound. Physica B: Condensed Matter. 2006, 382 (1-2): 279–284. ISSN 0921-4526. doi:10.1016/j.physb.2006.02.031.
- ^ Ganeshan, S.; Shang, S.L.; Zhang, H.; Wang, Y.; Mantina, M.; Liu, Z.K. Elastic constants of binary Mg compounds from first-principles calculations. Intermetallics. 2009, 17 (5): 313–318. ISSN 0966-9795. doi:10.1016/j.intermet.2008.11.005.
- ^ Morozkin, A.V.; Seropegin, Yu.D.; Gribanov, A.V.; Barakatova, J.M. Analysis of the melting temperatures of RT2 compounds (MgCu2 structure) (R=Rare Earth, T=Mn, Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt) and RT2X2 compounds (R=La, Ce, Sm, Er; T=Mn, Fe, Co, Ni, Cu, Ru, Rh, Pd, Pt; X=Si, Ge). Journal of Alloys and Compounds. 1997, 256 (1-2): 175–191. ISSN 0925-8388. doi:10.1016/S0925-8388(96)03017-4.
- ^ Shibata, Kazuya; Tanaka, Koji; Kurumatani, Kosuke; Nishida, Yasuki; Takeshita, Hiroyuki T. Thermodynamic Evaluation for Formation of MgCu2 from MgH2 and Cu: 221–226. 2013. doi:10.1002/9781118792148.ch28.
- ^ Arcot, Binny; Cabral, C.; Harper, J. M. E.; Murarka, S. P. Intermetallic Reactions Between Copper and Magnesium as an Adhesion / Barrier Layer. MRS Proceedings. 2011, 225. ISSN 0272-9172. doi:10.1557/PROC-225-231.
- ^ Birol, Yucel. Response to Thermal Exposure of Ball-Milled Cu-Mg/B2O3 Powder Blends. Metallurgical and Materials Transactions B. 2013, 44 (4): 969–973. ISSN 1073-5615. doi:10.1007/s11663-013-9860-6.
- ^ Volkova, L. S.; Kalinnikov, G. V.; Ivanov, A. V.; Shilkin, S. P. Synthesis of Mg2Cu and MgCu2 nanoparticles in a KCl-NaCl-MgCl2 melt. Inorganic Materials. 2012, 48 (11): 1078–1081. ISSN 0020-1685. doi:10.1134/S0020168512110179.